Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.].
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Item type | Current location | Call number | Materials specified | Copy number | Status | Date due | Barcode |
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 ELE 1998 (Browse shelf) | 18243 | Available | 0000019332 | ||
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 ELE 1998 (Browse shelf) | 18244 | Available | 0000019333 | ||
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 ELE 1998 (Browse shelf) | 18245 | Available | 0000019334 |
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621.381046 ELE 1991 Electronics packaging forum; edited by James E. Morris. | 621.381046 ELE 1998 Electronic packaging : design, materials, process, and reliability | 621.381046 ELE 1998 Electronic packaging : design, materials, process, and reliability | 621.381046 ELE 1998 Electronic packaging : design, materials, process, and reliability | 621.381046 ELE 1999 Electronic packaging materials and their properties | 621.381046 FLI 1996 Flip chip technologies | 621.381046 GIL 2002 Area array packaging handbook |
Includes bibliographical references and index
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