Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harman.
Material type:
TextPublisher: New York McGraw-Hill 1997Edition: 2nd edDescription: xiv, 290p. ill. 24cmISBN: 0070326193 Subject(s): Electronic packaging -- Defects | Electronic packaging -- Reliability | Wire bonding (Electronic packaging) -- Production controlDDC classification: 621.3815 HAR 1997
| Item type | Current location | Call number | Materials specified | Copy number | Status | Date due | Barcode |
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.3815 HAR 1997 (Browse shelf) | 15140 | Available | 0000016191 | ||
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.3815 HAR 1997 (Browse shelf) | 15141 | Available | 0000016192 | ||
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.3815 HAR 1997 (Browse shelf) | 15142 | Available | 0000016193 |
Includes index
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
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