HWANG Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. - New York McGraw Hill 1996. - xliv, 622p. ill. 24cm - Electronic packaging and interconnection series . Includes bibliographical references and index ISBN: 0070317496 Subjects--Topical Terms: Electronic packagingSolder and soldering Dewey Class. No.: 621.381046 HWA 1996