3D IC stacking technology / Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors. - 1st ed.. - New York McGraw-Hill Professional c2011. - xviii, 521p ill 24cm ISBN: 9780071741958 Subjects--Topical Terms: Microelectronic packagingThree-dimensional integrated circuits Dewey Class. No.: 621.38153 THR 2011