TY  - BOOK
AU  - Kumar, Ajay
AU  - Ramaswami, Sesh
AU  - Wu, Banqiu
TI  - 3D IC stacking technology 
SN  - 9780071741958
U1  - 621.38153 THR 2011 
PY  - 2011///
CY  - New York
PB  - McGraw-Hill Professional
KW  - Microelectronic packaging
KW  - Three-dimensional integrated circuits
ER  -