Ball grid array technology  
/ editor, John H. Lau. 
 - New York  McGraw-Hill, Inc.  1995. 
 - xviii, 636p.  ill.  24cm 
 - Electronic packaging and interconnection series .
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>007036608X  
<br/><br/><label>Subjects--Topical Terms: </label><br/>Ball grid array technology
<br/><br/><label>Dewey Class. No.: </label>621.381046 BAL 1995