TY  - BOOK
AU  - Lau, John H.
TI  - Ball grid array technology 
T2  - Electronic packaging and interconnection series
SN  - 007036608X 
U1  - 621.381046 BAL 1995 
PY  - 1995///
CY  - New York
PB  - McGraw-Hill, Inc.
KW  - Ball grid array technology
N1  - Includes bibliographical references and index
ER  -