TY  - BOOK
AU  - Stephenson, D. J.
TI  - Diffusion bonding 2 
SN  - 1851665919 
U1  - 671.58 INT 1991 
PY  - 1991///
CY  - London
PB  - Elsevier Applied Science
KW  - Aluminum alloys
KW  - Bonding
KW  - Congresses
KW  - Diffusion bonding (Metals)
KW  - Heat resistant materials
N1  - "Proceedings of the Second International Conference on Diffusion Bonding, held at Cranfield Institute of Technology, U.K., from 28 to 29 March, 1990."; Includes bibliographical references
ER  -