Wire bonding in microelectronics / / George G. Harmon.
Material type:
TextPublisher: New York McGraw-Hill c2010Edition: 3rd edDescription: xx,426p. : ill. ; 24cm. + 1 CD-ROM (4 3/4 in.)ISBN: 9780071476232 Subject(s): Electronic packaging -- Defects | Electronic packaging -- Reliability | Semiconductors -- Failures | Wire bonding (Electronic packaging) -- Production controlDDC classification: 621.3815 HAR 2010
| Item type | Current location | Call number | Materials specified | Copy number | Status | Date due | Barcode |
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.3815 HAR 2010 (Browse shelf) | Available | 0000052295 | |||
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.3815 HAR 2010 (Browse shelf) | Available | 0000051837 | |||
CD-ROM
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Perpustakaan Ibnu Khaldun Media Collection | 621.3815 HAR 2010 (Browse shelf) | Available | 0000051838 | |||
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CD-ROM
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Perpustakaan Ibnu Khaldun Media Collection | 621.3815 HAR 2010 (Browse shelf) | 50999 | Available | 0000052296 |
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989
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