| 000 | 00672nam a2200229#a 4500 | ||
|---|---|---|---|
| 001 | 0000029254 | ||
| 008 | 211117s2020||||xx |||||||||||||| ||und|| | ||
| 020 |
_a9780071741958 _q(hardback) |
||
| 082 | _a621.38153 THR 2011 | ||
| 245 | 0 |
_a3D IC stacking technology _c/ Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors. |
|
| 250 | _a1st ed.. | ||
| 260 |
_aNew York _bMcGraw-Hill Professional _cc2011. |
||
| 300 |
_axviii, 521p _bill _c24cm |
||
| 365 | _cMYR | ||
| 650 | _aMicroelectronic packaging | ||
| 650 | _aThree-dimensional integrated circuits | ||
| 700 | _aKumar, Ajay | ||
| 700 | _aRamaswami, Sesh | ||
| 700 | _aWu, Banqiu | ||
| 942 | _cBK-GN | ||
| 999 |
_c28134 _d28134 |
||