HWANG
Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. - New York McGraw Hill 1996. - xliv, 622p. ill. 24cm - Electronic packaging and interconnection series .
Includes bibliographical references and index
0070317496
Electronic packaging
Solder and soldering
621.381046 HWA 1996
Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. - New York McGraw Hill 1996. - xliv, 622p. ill. 24cm - Electronic packaging and interconnection series .
Includes bibliographical references and index
0070317496
Electronic packaging
Solder and soldering
621.381046 HWA 1996