Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang.
Material type:
TextSeries: Electronic packaging and interconnection seriesPublisher: New York McGraw Hill 1996Description: xliv, 622p. ill. 24cmISBN: 0070317496 Subject(s): Electronic packaging | Solder and solderingDDC classification: 621.381046 HWA 1996
| Item type | Current location | Call number | Materials specified | Copy number | Status | Date due | Barcode |
|---|---|---|---|---|---|---|---|
Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 HWA 1996 (Browse shelf) | 6730 | Available | 0000007723 | ||
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 HWA 1996 (Browse shelf) | 11318 | Available | 0000012354 | ||
|
Book-GN
|
Perpustakaan Ibnu Khaldun General Collection | 621.381046 HWA 1996 (Browse shelf) | 11319 | Available | 0000012355 | ||
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Book-GN
|
Perpustakaan Ibnu Khaldun General Collection | 621.381046 HWA 1996 (Browse shelf) | 11320 | Available | 0000012356 |
Includes bibliographical references and index
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