Lau
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / authors, John H. Lau and Yi-Hsin Pao. - New York McGraw Hill 1997. - xxi, 408p. ill. 24cm
Includes bibliographical references and index
0070366489
Microelectronic packaging--Reliability
Multichip modules (Microelectronics)--Testing
Semiconductors--Reliability
Solder and soldering--Testing
621.381046 LAU 1997
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / authors, John H. Lau and Yi-Hsin Pao. - New York McGraw Hill 1997. - xxi, 408p. ill. 24cm
Includes bibliographical references and index
0070366489
Microelectronic packaging--Reliability
Multichip modules (Microelectronics)--Testing
Semiconductors--Reliability
Solder and soldering--Testing
621.381046 LAU 1997