Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / authors, John H. Lau and Yi-Hsin Pao.
Material type:
TextPublisher: New York McGraw Hill 1997Description: xxi, 408p. ill. 24cmISBN: 0070366489 Subject(s): Microelectronic packaging -- Reliability | Multichip modules (Microelectronics) -- Testing | Semiconductors -- Reliability | Solder and soldering -- TestingDDC classification: 621.381046 LAU 1997
| Item type | Current location | Call number | Materials specified | Copy number | Status | Date due | Barcode |
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 LAU 1997 (Browse shelf) | 6864 | Available | 0000007861 | ||
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 LAU 1997 (Browse shelf) | 15746 | Available | 0000016817 | ||
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 LAU 1997 (Browse shelf) | 15747 | Available | 0000016818 | ||
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Book-GN
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 LAU 1997 (Browse shelf) | 15748 | Available | 0000016819 |
Includes bibliographical references and index
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