Koha online catalog › Results of search for 'ccl=su:"Packaging"'

Your search returned 5 results.

	1.	Reliability of electronic packages and semiconductor devices / Giulio Di Giacomo. by DI GIACOMO. Material type: Text Publisher: New York McGraw Hill 1997Availability: Items available for loan: Call number: 621.381046 DIG 1997 (3). Items available for reference: Not for loanCall number: 621.381046 DIG 1997 (1). Place hold Add to cart (remove)
	2.	Thermal management handbook : for electronic assemblies / Jerry E. Sergent, Al Krum. by Sergent \| Krum, Al. Material type: Text Publisher: New York McGraw Hill 1998Availability: Items available for reference: Not for loanCall number: 621.381 SER 1998 (6). : Add to cart (remove)
	3.	Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. by HWANG. Material type: Text Publisher: New York McGraw Hill 1996Availability: Items available for loan: Call number: 621.381046 HWA 1996 (4). Place hold Add to cart (remove)
	4.	Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.]. by Lau, John H. Material type: Text Publisher: New York McGraw Hill 1998Availability: Items available for loan: Call number: 621.381046 ELE 1998 (3). Place hold Add to cart (remove)
	5.	Flip chip technologies / editor, John H. Lau. by Lau, John H. Material type: Text Publisher: New York McGraw Hill 1996Availability: Items available for loan: Call number: 621.381046 FLI 1996 (1). Place hold Add to cart (remove)