3D IC stacking technology
/ Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors.
- 1st ed..
- New York McGraw-Hill Professional c2011.
- xviii, 521p ill 24cm
9780071741958
Microelectronic packaging
Three-dimensional integrated circuits
621.38153 THR 2011
9780071741958
Microelectronic packaging
Three-dimensional integrated circuits
621.38153 THR 2011