| 000 -LEADER |
|---|
| fixed length control field |
00672nam a2200229#a 4500 |
| 001 - CONTROL NUMBER |
|---|
| control field |
0000029254 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
211117s2020||||xx |||||||||||||| ||und|| |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9780071741958 |
| Qualifying information |
(hardback) |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.38153 THR 2011 |
| 245 #0 - TITLE STATEMENT |
|---|
| Title |
3D IC stacking technology |
| Statement of responsibility, etc. |
/ Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors. |
| 250 ## - EDITION STATEMENT |
|---|
| Edition statement |
1st ed.. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. |
|---|
| Place of publication, distribution, etc. |
New York |
| Name of publisher, distributor, etc. |
McGraw-Hill Professional |
| Date of publication, distribution, etc. |
c2011. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xviii, 521p |
| Other physical details |
ill |
| Dimensions |
24cm |
| 365 ## - TRADE PRICE |
|---|
| Currency code |
MYR |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Microelectronic packaging |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Three-dimensional integrated circuits |
| 700 ## - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Kumar, Ajay |
| 700 ## - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Ramaswami, Sesh |
| 700 ## - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Wu, Banqiu |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Koha item type |
Book-GN |
