3D IC stacking technology / Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors.
Material type:
TextPublisher: New York McGraw-Hill Professional c2011Edition: 1st edDescription: xviii, 521p ill 24cmISBN: 9780071741958Subject(s): Microelectronic packaging | Three-dimensional integrated circuitsDDC classification: 621.38153 THR 2011
| Item type | Current location | Call number | Materials specified | Status | Date due | Barcode |
|---|---|---|---|---|---|---|
Book-GN
|
Perpustakaan Ibnu Khaldun General Collection | 621.38153 THR 2011 (Browse shelf) | Available | 0000053897 |
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