Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang.
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Item type | Current location | Call number | Materials specified | Copy number | Status | Date due | Barcode |
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 HWA 1996 (Browse shelf) | 6730 | Available | 0000007723 | ||
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 HWA 1996 (Browse shelf) | 11318 | Available | 0000012354 | ||
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 HWA 1996 (Browse shelf) | 11319 | Available | 0000012355 | ||
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Perpustakaan Ibnu Khaldun General Collection | 621.381046 HWA 1996 (Browse shelf) | 11320 | Available | 0000012356 |
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621.381046 FLI 1996 Flip chip technologies | 621.381046 GIL 2002 Area array packaging handbook | 621.381046 HWA 1996 Modern solder technology for competitive electronics manufacturing | 621.381046 HWA 1996 Modern solder technology for competitive electronics manufacturing | 621.381046 HWA 1996 Modern solder technology for competitive electronics manufacturing | 621.381046 HWA 1996 Modern solder technology for competitive electronics manufacturing | 621.381046 LAU 1997 Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies |
Includes bibliographical references and index
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