Koha online catalog › Results of search for 'su:"Packaging"'

	1.	Adhesives technology for electronic applications : materials, processing, reliability / James J. Licari and Dale W. Swanson. by Licari, James J, 1930- \| Swanson, Dale W. Edition: 2nd ed..Material type: Text Publisher: Waltham William Andrew Pub. c2011Availability: Items available for loan: Call number: 621.381 LIC 2011 (1). Place hold Add to cart (remove)
	2.	LED packaging for lighting applications : design, manufacturing and testing / Sheng Liu, Xiaobing Luo. by Liu, S., 1963- (Sheng) \| Luo, Xiaobing, 1974-. Material type: Text Publisher: Singapore John Wiley & Sons (Asia) 2011Availability: Items available for loan: Call number: 621.381522 LIU 2011 (1). Place hold Add to cart (remove)
	3.	Semiconductor packaging : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo. by Chen, Andrea \| Lo, Randy. Material type: Text Publisher: Boca Raton, FL CRC Press c2012Availability: Items available for loan: Call number: 621.38152 CHE 2012 (1). Place hold Add to cart (remove)
	4.	Packaging design : successful product branding from concept to shelf / Marianne Rosner Klimchuk and Sandra A. Krasovec. by Klimchuk, Marianne Rosner \| Krasovec, Sandra A. Material type: Text Publisher: Hoboken, N.J. J. Wiley & Sons c2006Availability: Items available for loan: Call number: 658.564 KLI 2006 (1). Place hold Add to cart (remove)
	5.	Multichip module technology handbook / Philip E. Garrou, Iwona Turlik. by Garrou \| Turlik, Iwona. Material type: Text Publisher: New York McGraw Hill 1998Availability: Items available for reference: Not for loanCall number: 621.381 GAR 1998 (5). : Add to cart (remove)
	6.	Reliability of electronic packages and semiconductor devices / Giulio Di Giacomo. by DI GIACOMO. Material type: Text Publisher: New York McGraw Hill 1997Availability: Items available for loan: Call number: 621.381046 DIG 1997 (3). Items available for reference: Not for loanCall number: 621.381046 DIG 1997 (1). Place hold Add to cart (remove)
	7.	Thermal management handbook : for electronic assemblies / Jerry E. Sergent, Al Krum. by Sergent \| Krum, Al. Material type: Text Publisher: New York McGraw Hill 1998Availability: Items available for reference: Not for loanCall number: 621.381 SER 1998 (6). : Add to cart (remove)
	8.	Package & label design. Material type: Text Publisher: Massachusetts Rockport Publishers 1997Availability: Items available for reference: Not for loanCall number: 741.692 PAC 1997 (1). : Add to cart (remove)
	9.	Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. by HWANG. Material type: Text Publisher: New York McGraw Hill 1996Availability: Items available for loan: Call number: 621.381046 HWA 1996 (4). Place hold Add to cart (remove)
	10.	Multichip module design, fabrication and testing / James J. Licari. by Licari. Material type: Text Publisher: New York McGraw Hill 1995Availability: Items available for loan: Call number: 621.381046 LIC 1995 (1). Place hold Add to cart (remove)
	11.	Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / authors, John H. Lau and Yi-Hsin Pao. by Lau \| Pao, Yi-Hsin. Material type: Text Publisher: New York McGraw Hill 1997Availability: Items available for loan: Call number: 621.381046 LAU 1997 (4). Place hold Add to cart (remove)
	12.	Quality conformance and qualification of microelectronic packages and interconnects / editors Michael Pecht (et...al). by Pecht, Michael. Material type: Text Publisher: New York John Wiley & Sons, Inc 1993Availability: Items available for loan: Call number: 621.381046 QUA 1993 (1). Place hold Add to cart (remove)
	13.	Electronic packaging and interconnection handbook / editor-in-chief, Charles A. Harper. by Harper, Charles A. Edition: 2nd ed..Material type: Text Publisher: New York McGraw Hill 1997Availability: Items available for reference: Not for loanCall number: 621.381046 ELE 1997 (3). : Add to cart (remove)
	14.	The handbook of machine soldering : SMT and TH / Ralph W. Woodgate. by Woodgate. Edition: 3rd ed..Material type: Text Publisher: New York John Wiley & Sons 1996Availability: Items available for reference: Not for loanCall number: 621.381531 WOO 1996 (1). : Add to cart (remove)
	15.	Air cooling technology for electronic equipment / edited by Sung Jin Kim, Sang Woo Lee. by Kim, Sung Jin \| Lee, Sang Woo. Material type: Text Publisher: New York CRC Press, Inc 1996Availability: Items available for loan: Call number: 621.381 AIR 1996 (3). Place hold Add to cart (remove)
	16.	Thin film technology handbook / Aicha A. R. Elshabini-Riad, Fred D. Barlow III. by Elshabini-Riad \| Barlow, Fred D. Material type: Text Publisher: New York McGraw-Hill 1998Availability: Items available for reference: Not for loanCall number: 621.38152 ELS 1998 (3). : Add to cart (remove)
	17.	The Wiley encyclopedia of packaging technology / edited by Aaron L. Brody, Kenneth S. Marsh. by Brody, Aaron L \| Marsh, Kenneth S. Edition: 2nd. ed..Material type: Text Publisher: New York John Wiley & Sons 1997Availability: Items available for loan: Call number: 688.903 WIL 1997 (1). Place hold Add to cart (remove)
	18.	Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht. by Pecht. Material type: Text Publisher: New York John Wiley & Sons 1994Availability: Items available for loan: Call number: 621.381046 PEC 1994 (3). Place hold Add to cart (remove)
	19.	Chip scale package, CSP : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee. by Lau \| Lee, Shi-Wei Ricky. Material type: Text Publisher: New York McGraw Hill 1999Availability: Items available for loan: Call number: 621.3815 LAU 1999 (9). Place hold Add to cart (remove)
	20.	Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.]. by Lau, John H. Material type: Text Publisher: New York McGraw Hill 1998Availability: Items available for loan: Call number: 621.381046 ELE 1998 (3). Place hold Add to cart (remove)

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Your search returned 125 results.